Cooling system for vehicle motor drive

ABSTRACT

Modular cooling assemblies are provided for simultaneously cooling both a power module and a vehicle motor. Each cooling assembly may include a first cooling structure defining at least one major surface in thermal communication with the vehicle motor. A second cooling structure may be provided, defining at least one major surface in thermal communication with a power module. An interlayer structure may be provided, configured to couple the first cooling structure to the second cooling structure. The first cooling structure, the second cooling structure, and the interlayer structure are positioned in a stacked arrangement and configured to provide a flow of coolant fluid from a fluid inlet defined in first cooling structure, through the interlayer structure, and to at least one heat sink feature of the second cooling structure. The coolant fluid is then directed through a fluid outlet defined in the second cooling structure.

TECHNICAL FIELD

The present disclosure generally relates to cooling systems and, moreparticularly, to a power electronics cooling system for the simultaneouscooling of both a vehicle motor and a power module.

BACKGROUND

The background description provided herein is for the purpose ofgenerally presenting the context of the disclosure. Work of thepresently named inventors, to the extent it may be described in thisbackground section, as well as aspects of the description that may nototherwise qualify as prior art at the time of filing, are neitherexpressly nor impliedly admitted as prior art against the presenttechnology.

Many components of electric and hybrid vehicles, such as powerelectronic devices and the vehicle motor, may require cooling duringoperation. Heat management devices have been used, coupled to a heatgeneration device, such as a power electronics device, to remove heatand lower the operating temperature of the power electronics device. Forexample, a cooling fluid may be introduced to the heat managementdevice, where it receives heat from the heat management device,primarily through convective and/or conductive heat transfer. Thecooling fluid is then removed from the heat management device, therebyremoving heat from the power electronics device. However, since thethermal demands of a power electronics device and a vehicle motor mayvary due to heat flux differences, a unified cooling system thatefficiently accommodates both power electronics devices, as well as avehicle motor, is complicated.

Various cooling processes have been proposed and attempted. However,certain attempts have been met with varying degrees of limited success,either in the effectiveness in the removal of heat and/or in the complexand costly design of the cooling system. Accordingly, there remains aneed for an improved way of cooling components of electric vehicles.

This section provides a general summary of the disclosure, and is not acomprehensive disclosure of its full scope or all of its features.

In various aspects, the present teachings provide a cooling system forsimultaneously cooling both a power module and a vehicle motor. Thecooling system includes a vehicle motor housing and a plurality ofmanifolds in thermal communication with the vehicle motor housing. Eachmanifold defines a cooling fluid inlet, a cooling fluid outlet, and adistribution recess providing fluid communication between the coolingfluid inlet and the cooling fluid outlet. The distribution recess may bedefined by a wall having an exterior major surface in thermalcommunication with the vehicle motor. A manifold fluid insert may bedisposed within the distribution recess, defining a plurality of inletbranch channels and outlet branch channels. A power module may becoupled to the manifold, and a first heat sink feature disposed betweenthe power module and the manifold fluid insert. A flow of coolant fluidis provided from each cooling fluid inlet, through the inlet branchchannels of the manifold fluid insert for impingement with the firstheat sink feature. The coolant fluid is then returned through the outletbranch channels of the manifold fluid insert and to the cooling fluidoutlet of the respective manifold.

In other aspects, the present teachings provide a cooling systemincluding a plurality of layered assemblies for simultaneously coolingboth a power module and a vehicle motor. Each layered assembly mayinclude a first layer defining upper and lower opposing major surfaces.The upper major surface of the first layer includes a heat sink featurein thermal communication with one of the power module and the vehiclemotor. A second layer is provided defining upper and lower opposingmajor surfaces. The upper major surface of the second layer is locatedadjacent to the lower major surface of the first layer. A third layer isprovided defining upper and lower opposing major surfaces. The uppermajor surface of the third layer is located adjacent to the lower majorsurface of the second layer, and the lower major surface of the thirdlayer is in thermal communication with the other of the power module andthe vehicle motor. The first layer, the second layer, and the thirdlayer are positioned in a stacked arrangement and configured to providea flow of coolant fluid from a fluid inlet, defined in the third layer,through an inner region of the second layer, and to the heat sinkfeature disposed in the first layer. The coolant fluid is then directedback through an outer region of the second layer and to a fluid outletdefined in the third layer.

In still other aspects, the present teachings provide a modular coolingsystem for simultaneously cooling both a power module and a vehiclemotor. The modular cooling system may include a plurality of coolingassemblies. Each cooling assembly may include a first cooling structuredefining at least one major surface in thermal communication with thevehicle motor. A second cooling structure may be provided, defining atleast one major surface in thermal communication with a power module. Aninterlayer structure may be provided, configured to couple the firstcooling structure to the second cooling structure. The first coolingstructure, the second cooling structure, and the interlayer structuremay be positioned in a stacked arrangement and configured to provide aflow of coolant fluid from a fluid inlet defined in first coolingstructure, through the interlayer structure, and to at least one heatsink feature of the second cooling structure. The coolant fluid is thendirected through a fluid outlet defined in the second cooling structure.

Further areas of applicability and various methods of enhancing theabove technology will become apparent from the description providedherein. The description and specific examples in this summary areintended for purposes of illustration only and are not intended to limitthe scope of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The present teachings will become more fully understood from thedetailed description and the accompanying drawings, wherein:

FIG. 1A is an isometric view of an exemplary vehicle motor and vehiclemotor housing having a cooling system with a plurality of assemblies forsimultaneously cooling both power modules and a vehicle motor;

FIG. 1B is an isometric view of the vehicle motor housing and coolingsystem of FIG. 1A;

FIG. 1C is an exploded, isometric view of the vehicle motor housing andcooling system of FIG. 1B illustrating a plurality of manifolds andconduits integrally formed as part of the vehicle motor housing;

FIG. 2 is a side plan view of the vehicle motor housing of FIG. 1Bhaving the plurality of integral manifolds and conduits;

FIG. 3 is an isometric, partial cross-sectional view the vehicle motorhousing of FIG. 2 taken along the line 3-3;

FIG. 4 is a side plan view of another exemplary vehicle motor housinghaving a plurality of modular manifold units disposed adjacent thevehicle motor housing;

FIG. 5A is an isometric view of an exemplary assembly with a modularmanifold unit according to a first aspect;

FIG. 5B illustrates the assembly with the modular manifold unit of FIG.5A having a plurality of power modules thermally coupled thereto;

FIG. 5C is an exploded, isometric view of the assembly with the modularmanifold unit of FIG. 5B;

FIG. 6A is a top plan view of the exemplary assembly with the modularmanifold unit of FIGS. 5A-5C illustrating a plurality of manifold fluidinserts located in a respective plurality of distribution recesses;

FIG. 6B is an isometric, partial cross-sectional view of the modularmanifold unit of FIG. 6A illustrating further details of a cooling fluidinlet conduit;

FIG. 7A is a side perspective view of an exemplary heat sink plate witha plurality of aligned fins as a heat sink feature;

FIG. 7B is a side plan view of the exemplary heat sink plate and heatsink feature of FIG. 7A;

FIG. 8A is an isometric view of an exemplary manifold fluid insert withinlet and outlet branch channels disposed adjacent a heat sink featureand a heat sink plate according to a first aspect;

FIG. 8B is an isometric view of an exemplary manifold fluid insert withtapered inlet branch channels walls disposed adjacent a heat sinkfeature and a heat sink plate according to a second aspect;

FIG. 9A is a bottom plan view of the manifold fluid insert according toone aspect;

FIG. 9B is an isometric view showing the bottom of the manifold fluidinsert of FIG. 9A;

FIG. 9C is a side perspective view showing the outlet branch channels ofthe manifold fluid insert of FIG. 9A;

FIG. 9D is a top plan view of an exemplary manifold fluid insert of FIG.9A;

FIG. 9E is an isometric view showing the top of the manifold fluidinsert of FIG. 9A;

FIG. 10 is a partially exploded, isometric view of an exemplary assemblywith a modular manifold unit according to a second aspect;

FIG. 11 is a side plan view of the exploded view of the assembly withthe modular manifold unit of FIG. 10;

FIG. 12 is a side plan view of an exemplary power module with anintegrated heat sink feature;

FIG. 13 is a side plan view of another exemplary vehicle motor housinghaving a modular cooling system with a plurality of layered assembliesdisposed adjacent the vehicle motor housing;

FIG. 14 is an isometric view of an exemplary layered cooling assembly asshown in FIG. 13;

FIG. 15 is an exploded, isometric view of the layered cooling assemblyof FIG. 14;

FIG. 16 is a top plan view of a first layer of the layered coolingassembly of FIG. 14;

FIG. 17 is a top plan view of a second layer of the layered coolingassembly of FIG. 14;

FIG. 18 is a top plan view of a third layer of the layered coolingassembly of FIG. 14;

FIG. 19 is a side plan view of another exemplary vehicle motor housinghaving a modular cooling system with a plurality of cooling assembliesdisposed adjacent the vehicle motor housing; and

FIG. 20 is an exploded, isometric view of an exemplary cooling assemblyof FIG. 19.

It should be noted that the figures set forth herein are intended toexemplify the general characteristics of the methods and devices amongthose of the present technology, for the purpose of the description ofcertain aspects. These figures may not precisely reflect thecharacteristics of any given aspect, and are not necessarily intended todefine or limit specific embodiments within the scope of thistechnology. Further, certain aspects may incorporate features from acombination of figures.

DETAILED DESCRIPTION

The present technology provides systems and methods for powerelectronics cooling that are configured to simultaneously cool both apower module and a vehicle motor (e.g., the stator of the vehiclemotor). In various aspects, this technology may be directed to a vehiclemotor for an electric or hybrid vehicle. The beneficial unified coolingof two or more heat generating devices can be accomplished by providingcooling assemblies disposed adjacent a vehicle motor housing, in thermalcommunication with the vehicle motor on one side, and in thermalcommunication with a power module on an opposite side. The coolingassemblies may direct a flow of a coolant fluid to concurrently removeheat from the two or more heat generating devices. In certain aspects,the cooling assemblies may be integrated with the vehicle motor itself,in one example, integrated with the vehicle motor housing adjacent thestator. In other aspects, the technology provides for a plurality ofmodular cooling assemblies that may be coupled to the vehicle motor and,in particular, coupled to the vehicle motor housing.

For simplicity, the heat generating devices useful with the presenttechnology, other than the vehicle motor (stator), are generallyreferred to herein as power modules. Power modules may include, but arenot limited to, inverters and capacitors, electronics devices such assemiconductor devices, insulated gate bipolar transistors (IGBT),metal-oxide-semiconductor field effect transistors (MOSFET), powerdiodes, power bipolar transistors, power thyristor devices, and thelike. The power module may be a component in an inverter and/orconverter circuit used to electrically power high load devices, such aselectric motors in electrified vehicles (e.g., hybrid vehicles, plug inhybrid electric vehicles, plug in electric vehicles, and the like).

For a general understanding of the environment of the presenttechnology, FIG. 1A provides an isometric view of an exemplary assembly50 including a vehicle motor 52 and vehicle motor housing 54 having acooling system with a plurality of cooling assemblies 56 forsimultaneously cooling both a plurality of power modules 58 and thevehicle motor 52. Generally, the vehicle motor 52 may include variousstandard components, such as a shaft 60, rotor 62, stator 64, andvehicle motor housing (stator housing) 54. It should be understood thatthe various internal details of vehicle motor 52 are not shown forsimplicity. In various aspects, the power modules 58 may ultimately becoupled to vehicle motor housing 54, such that rotation of the shaft 60and rotor 62 do not rotate the power modules 58.

FIG. 1B is an isometric view of the vehicle motor housing 54 and coolingsystem of FIG. 1A without the internal components of the vehicle motor52. FIG. 1C is an exploded, isometric view of the vehicle motor housing54 and cooling system of FIG. 1B, further illustrating the coolingassemblies 56 including a plurality of integral manifolds 66, coolingfluid inlets 68, and cooling fluid outlets 70 integrally formed as partof the vehicle motor housing 54. FIG. 2 is a side plan view of thevehicle motor housing 54 of FIG. 1B having the plurality of integralmanifolds 66 and cooling fluid inlets 68 and outlets 70. FIG. 3 is anisometric, partial cross-sectional view the vehicle motor housing 54 ofFIG. 2 taken along the line 3-3. In certain aspects, as specificallyshown in FIG. 3, it may be desirable for the cooling fluid inlets 68 tobe provided on a first side 72 of the vehicle motor housing 54, and thecooling fluid outlets 70 to be provided on a second side 74 of thevehicle motor housing 54, opposite from the first side 72. It should beunderstood that in other aspects, the arrangement may be the opposite,and in still other aspects, the cooling fluid inlets 68 and outlets 70may be provided on the same side of the vehicle motor housing 54. Whilethe vehicle motor housing 54 is shown have an exterior perimeter 76generally shaped as an octagon with eight sides having coolingassemblies 56, and a substantially circular interior perimeter 78 thatwould be in thermal contact with the stator 64, other shapes may befeasible or preferred.

The coolant fluid may be any appropriate liquid, such as deionized wateror radiator fluid, and may be stored in an appropriate cooling fluidreservoir (not shown). Other non-limiting, exemplary coolant fluidsinclude water, organic solvents, inorganic solvents, and mixturesthereof. Examples of such solvents may include commercial refrigerantssuch as R-134a, R717, and R744. Selection of the composition of thecoolant fluid used in association with various power modules and vehiclemotor types may be selected based on, among other properties, theboiling point, the density, and the viscosity of the coolant fluid. Invarious examples, the coolant fluid may be directed in a jet in one ormore localized region at a high velocity such that the coolant fluidimpinges a surface of the heat sink feature and/or heat sink platethermally coupled to at least one heat generating device.

FIG. 4 is a side plan view of another exemplary vehicle motor housing 54having a plurality of modular manifold units 80 configured to serve ascooling assemblies disposed adjacent the exterior 76 of the vehiclemotor housing 54. FIG. 5A is an isometric view of an exemplary assemblywith modular manifold unit 80 according to a first aspect that includesa parallel aligned grouping 82 of three modular jet impingement regions84, 86, 88. The manifold unit 80 has an inlet side 90 with an inletconduit 92 providing fluid communication in the direction of the fluidpath arrow 93 between the coolant fluid inlet 68 and each of the threemodular jet impingement regions 84, 86, 88 via respective inletconnection tubes 94. The manifold unit 80 also has an outlet side 96with an outlet conduit 98 providing fluid communication between thethree modular jet impingement regions 84, 86, 88 via respective outletconnection tubes 100 (as best shown in FIG. 6A) to the cooling fluidoutlet 70 in the direction of the fluid path arrow 97. The manifold unitdefines a first major surface 102 and a second, opposing major surface104. A plurality of heat transfer or heat sink plates 106 may beprovided substantially flush with the first major surface 102. Eachmajor surface 102, 104 may be aligned in thermal coupling communicationwith a heat generating device, such as a power module 58 or the vehiclemotor 52.

FIG. 5B illustrates the assembly with the modular manifold unit 80 ofFIG. 5A with a plurality of power modules 58 thermally coupled thereto,and FIG. 5C is an exploded, isometric view of the assembly with themodular manifold unit 80 of FIG. 5B. As shown in FIG. 5C, eachimpingement region 84, 86, 88 defines a distribution recess 108 at leastpartially defined by a bottom wall 110 and an upstanding perimeter wall112. In various aspects, the opposing major side of the bottom wall 110also defines the exterior major surface 104 that may be in thermalcoupling communication with a heat generating device. A manifold fluidinsert 114 is disposed within each distribution recess. As will bediscussed in more detail below, each manifold fluid insert 114 maydefine a plurality of inlet branch channels 116 and outlet branchchannels 118.

FIG. 6A is a top plan view of the exemplary modular manifold unit 80 ofFIGS. 5A-5C illustrating the plurality of manifold fluid inserts 114located in a respective plurality of distribution recesses 108 to bettershow the coolant fluid flow path as indicated by the various directionalarrows. FIG. 6B is an isometric, partial cross-sectional view of themodular manifold unit 80 of FIG. 6A illustrating further details of acooling fluid inlet conduit 92 and inlet connection tubes 94.

FIG. 7A is a side perspective view of an exemplary heat sink plate 106,rotated 180 degrees from that shown in FIGS. 5A-5C and illustrating aheat sink feature including a plurality of aligned fins 107. FIG. 7B isa side plan view of the exemplary heat sink plate 106 and plurality ofaligned fins 107 as shown in FIG. 7A. It should be understood thatvarious different heat sink features may be used with the presenttechnology, such as a plurality of pins, microchannel arrays, or thelike, arranged in a suitable manner or alignment, so as to dissipateheat using a jet impingement process with the cooling fluid.

FIGS. 8A-8B illustrate isometric views of exemplary manifold fluidinserts 114 with one or more inlet branch channels 116 and one or moreoutlet branch channels 118, with the manifold fluid inserts 114 beingdisposed adjacent a heat sink feature 120 and a heat sink plate 106according to a first and second aspect.

As specifically shown, each manifold fluid insert 114 defines threeinlet branch channels 116 and two outlet branch channels 118, with thecoolant path as designated by the directional arrows. The inlet branchchannels 114 are fluidly coupled to the one or more angled inletconnection tubes 94 when the individual manifold fluid insert 114 ispositioned within the distribution recess 108 of the respectiveindividual impingement region 84, 86, 88, thereby defining a portion ofthe inlet coolant fluid flow path 93. The one or more outlet branchchannels 118 are fluidly coupled to the one or more outlet connectiontubes 100 when the individual manifold fluid inserts 114 are positionedwithin the respective distribution recesses 108 of the individualimpingement region 84, 86, 88, thereby defining another portion of theoutlet coolant fluid flow path 97. The one or more inlet branch channels114 and the one or more outlet branch channels 116 may be alternatelypositioned within the manifold fluid insert 114 such that each inletbranch channel 116 is positioned adjacent at least one outlet branchchannel 118, and each outlet branch channel 118 is positioned adjacentat least one inlet branch channel 116. Further, the manifold fluidinserts 114 may define a channel surface 120 positioned proximate thebottom wall 110 of the distribution recess 108 when the manifold fluidinsert 114 is disposed within the distribution recess 108 and a slotsurface 122 (FIGS. 9A-9B) positioned proximate the heat sink feature ofthe heat sink plate 106 when the heat sink plate 106 is coupled to themodular manifold unit 80.

In some aspects, for example the aspect depicted in FIG. 8B, the one ormore of the inlet branch channels 116 define one or more taperedportions 124. For example, a tapered portion 124 may be aligned with theone or more angled inlet connection tubes 94 and may be configured toalter the mass flow rate of coolant fluid traversing the fluid flowpath. Further, in other aspects, one or more of the outlet branchchannels 118 may also comprise one or more tapered portions. It shouldbe understood that the one or more inlet branch channels 116 and the oneor more outlet branch channels 118 may take a variety of configurationsincluding having a variety of slopes, lengths, discontinuous portions,non-linear portions, and the like without departing from the scope ofthe present technology.

FIGS. 9A-9E illustrate various views of an exemplary manifold fluidinsert 114. FIG. 9A is a bottom plan view of the manifold fluid insert114, and FIG. 9B is an isometric view showing the bottom of the manifoldfluid insert 114. FIG. 9C is a side perspective view, further showingthe outlet branch channels 118 of the manifold fluid insert 114. FIG. 9Dis a top plan view of a manifold fluid insert 114 defining a pluralityof impinging slots 126, and FIG. 9E is an isometric view showing the topof the manifold fluid insert 114.

As shown in FIGS. 9D-9E, the manifold fluid inserts 114 further defineone or more impinging slots 126 fluidly coupled to the one or more inletbranch channels 116 and may form a throughput portion of the manifoldfluid insert 114 such that coolant fluid may pass through the impingingslot 126, for example, as jets of coolant fluid. The impinging slots 126may define uniform or non-uniform shapes and cross-sectional areas andmay take a variety of sizes and shapes to provide jets of coolant fluidto impinge the heat sink plate 106, and transfer heat from the heat sinkplate 106 to the coolant fluid, as described in more detail below. Inoperation, the impinging slots 126 facilitate jet impingement from themanifold fluid inserts 114 to the heat sink plates 106.

With continued reference to FIGS. 9A through 9E, the manifold fluidinserts 114 further define one or more collecting slots 128 fluidlycoupled to the one or more outlet branch channels 116 and may formadditional throughput portions of the manifold fluid insert 114 suchthat coolant fluid may pass through the collecting slots 128. Thecollecting slots 128 are in fluid communication with the impinging slots126 such that coolant fluid that exits the manifold fluid insert 114through an individual impinging slot 126 reenters the manifold fluidinsert 114 through an individual collecting slot 128, for example, anadjacent collecting slot 128. The collecting slots 128 may defineuniform or non-uniform shapes and cross-sectional areas, and may take avariety of sizes and shapes to collect coolant fluid after it impingesthe heat sink feature of the heat sink plate 106 and transfer heat fromthe heat sink plate 106.

Referring back to FIG. 5A, the modular manifold unit 80 may include oneor more heat sink plates 106 coupled to the one or more impingementregions. It should be understood that any number of impingement regions84, 86, 88 and any number of heat sink plates 106 are contemplated. Forexample, in some embodiments, two or more heat sink plates 106 may becoupled to an individual impingement region 84, 86, 88 and in otherembodiments, an individual heat sink plate 106 may be coupled to two ormore impingement regions 84, 86, 88. The heat sink plates 106 may bemade from a thermally conductive material, for example and withoutlimitation, copper, aluminum, steel, thermally enhanced compositematerials, polymeric composite materials, graphite, or the like.

Referring back to FIG. 7A, each individual heat sink plate 106 maydefine an impingement surface 105 having the array of fins 107 thatextend towards the slot surface 122 of the manifold fluid insert 114removably positioned within the respective distribution recess 108. Thearray of fins 107 may be proximate to the manifold fluid insert 114, andin some embodiments, the array of fins 107 may contact the slot surface122 of the manifold fluid insert 114. As shown in FIG. 5C, the heat sinkplate 106 may be positioned within a heat sink plate receiving portion130 of the distribution recess 108. The impingement surface 105,including the array of fins 107, extends towards the manifold fluidinsert 114 such that the array of fins 107 are positioned proximate theimpinging slots 126 and the collecting slots 128 of the manifold fluidinsert 114, forming an impingement chamber there between. In anotheraspect, another heat sink feature, such as a heat sink plate 106, withor without a plurality of fins or pins, microchannel array, or the like,may also be positioned within the distribution recess 108 such that theheat sink plate 106 is adjacent the bottom wall 110, ultimately inthermal communication with the vehicle motor 52. In this regard, themanifold fluid insert 114 would be sandwiched between two heat sinkplates 106, and any other heat sink features there between. In yetanother aspect, the bottom wall 110 defining the distribution recess 108may be provided with an interior major surface 132, opposite theexterior major surface 104, that is integrated or coupled with a heatsink feature. In still other aspects, the bottom wall 110 may itself bea heat sink feature or heat sink/transfer plate.

In operation, the array of fins 107 receives coolant fluid from theimpinging slots 126 and the array of fins 107 directs coolant fluidtoward the collecting slots 128. For example, in some embodiments, theimpingement surface 105 may further include one or more grooves that maydirect coolant fluid flow through the impingement chamber. The one ormore grooves may be positioned within the array of fins 107. Forexample, the one or more grooves may run substantially parallel andproximate the impinging slots 126 and the collecting slots 128 of themanifold fluid insert 114 and may direct coolant fluid between impingingslots 126 and collecting slots 128. The heat sink plate 106 may becoupled to the heat sink plate receiving portion 130 through anyappropriate connection, creating a fluid-tight seal between therespective impingement region 84, 86, 88 and the heat sink plate 106,forming the respective impingement chamber therebetween. Exampleconnections include, but are not limited to, gaskets and mechanicalfasteners, o-rings, soldering, brazing, ultrasonic welding, and thelike. As described in more detail below, the one or more arrays of fins107 can correspond to the locations of the one or more heat generatingdevices, such as power modules, positioned proximate the heat sink plate107.

Any gaskets used may be made from a variety of materials that provide afluid-tight seal between generally non-compliant bodies. Examples ofsuch materials include, without limitation, natural or syntheticelastomers, compliant polymers such as silicone, and the like. The oneor more gaskets may also be made from an assembly that includescompliant materials and non-compliant materials, such that the one ormore gaskets provide desired sealing characteristics while maintainingtheir geometric configuration. In other embodiments, gaskets are notutilized, such as embodiments where soldering or brazing is used tocouple the heat sink plates 106.

Referring again to FIG. 7A, the one or more arrays of fins 107 increasethe local surface area of the heat sink plate 106, such that coolantfluid delivered to the heat sink plate 106 may efficiently convect heataway from the heat sink plate 106. By increasing the surface area of theheat sink plate 106, the heat transfer rate from the heat sink plate 106to the coolant fluid may be enhanced. In some embodiments, the heat sinkplate 106, including the one or more arrays of fins 107, may have avariety of configurations including being made from uniform, isotropicmaterials, non-isotropic materials, composite materials, or the like. Insome embodiments, the one or more arrays of fins 107 of the heat sinkplate 106 may include a coating, for example, a porous coating, thatincreases the surface area of the one or more arrays of fins 107,thereby increasing heat transfer away from the heat sink plate 106. Insome embodiments, the one or more arrays of fins 107 may be constructedfrom a porous material. Additionally, it should be understood that insome embodiments, the heat sink plates 106 may not be provided with theone or more arrays of fins 107.

FIG. 10 is a partially exploded, isometric view of an exemplary assemblywith a modular manifold unit 80 according to another aspect, where atleast one heat sink feature is integrated directly with, or directlycoupled to, one or more power modules 58 without the use of a separateheat sink plate 106 being located between the power module 58 andmanifold fluid insert 114 as otherwise shown in FIGS. 5B-5C. FIG. 11 isa side plan view of the exploded view of the modular manifold unit 80 ofFIG. 10, and FIG. 12 is a side plan view of an exemplary power module 58with an integrated heat sink feature. As shown, the power module 58 maybe provided with an integrated heat sink feature 134, for example, anarray of fins or pins coupled directly or indirectly to, and in thermalcommunication with, the power module 58. As shown, the integrated heatsink feature 134 may be similar in size and shape to the set of fins 107provided with the heat sink plate 106 as shown in FIGS. 7A-7B, andconfigured to work with the manifold fluid insert 114.

FIG. 13 is a side plan view of another exemplary vehicle motor housing54 having a modular cooling system with a plurality of layered coolingassemblies 150 disposed adjacent the vehicle motor housing 54 forsimultaneously cooling both a power module 58 and a vehicle motor 52.FIG. 14 is an isometric view of an exemplary layered cooling assembly150 as shown in FIG. 13, and FIG. 15 is an exploded, isometric view ofthe layered cooling assembly 150 showing the relationship between threelayers 152, 154, and 156. It should be understood that while theassemblies 150 are shown with a generally rectangular shape, othershapes and designs are well within the scope of the present technology.Similarly, while three layers are specifically shown, alternate designsmay use additional or fewer layers, and it is also envisioned that theparticular integration of a plurality of layers can also be accomplishedusing 3-D printing technology to create a single layer having the samefeatures, such as the coolant paths, resulting from the assembledlayered combination of three different substantially planar structures.The layers 152, 154, 156 may comprise similar thermally conductivematerials as those discussed above with respect to the heat sink plate106.

FIG. 16 is a top plan view of a first layer 152 of the layered coolingassembly 150, FIG. 17 is a top plan view of a second layer 154 of thelayered cooling assembly 150, and FIG. 18 is a top plan view of a thirdlayer 156 of the layered cooling assembly 15 of FIG. 14.

FIGS. 15 and 16 illustrate details of the first layer 152 defining anupper major surface 158 and a lower opposing major surface 160. Theupper major surface 158 of the first layer 152 includes at least oneheat sink feature 162 that is configured to be in thermal communicationwith either one of a power module 58 (as shown) and the vehicle motor 52(not shown).

FIGS. 15 and 17 illustrate details of the second layer 154 defining anupper major surface 164 and a lower opposing major surface 166, theupper major surface 164 of the second layer 154 being located adjacentto the lower major surface 160 of the first layer 152 in the assembledstate.

FIGS. 15 and 18 illustrate details of the third layer 156 defining anupper major surface 168 and a lower opposing major surface 170, theupper major surface 168 of the third layer 156 being located adjacent tothe lower major surface 166 of the second layer 154, and the lower majorsurface 170 of the third layer 156 being in thermal communication witheither one of the power module 58 and the vehicle motor 52 in theassembled state.

As shown, the bottom layer, or the third layer 156, defines a coolingfluid inlet 172 and a cooling fluid outlet 174. Further details of thecoolant fluid circuit prior to entry in the inlet 172 and after exitingthe outlet 174 are not shown for simplicity, and will depend on whetherthe third layer 156 is intended to be in thermal communication with thevehicle motor 52 or the power module 58. For ease in understanding, thedescription that follows will be based on a first aspect where the firstlayer 152 is in thermal communication with a power module 58, and thethird layer is in thermal communication with a vehicle motor 52. If itis desirable to provide an assembly with the reverse configuration, oneof ordinary skill in the art would be able to make the appropriatemodifications.

The upper major surface 168 of the third layer 156 defines a recessedfluid channel 176 therein. Coolant fluid passing through the recessedchannel 176 will be in thermal communication with the heat generatingdevice, such as a vehicle motor, located adjacent the lower majorsurface 170 of the third layer 156. As shown, the shape of the fluidchannel 176 may be substantially trapezoidal, beginning with a largerwidth outer region 178 near the cooling fluid inlet 172 and leading to asmaller or narrower width inner region 180 in a direction towards thecenter area of the layer 156. The upper major surface 164 of the secondlayer 154 also defines a recessed fluid channel 182 therein. Similarly,the shape of the fluid channel 182 of the second layer 154 may also besubstantially trapezoidal in shape, having a narrower width inner region184 near a center area of the layer 154, leading to a larger width outerregion 186 defining a cooling fluid outlet 188, which is in fluidcommunication with the cooling fluid outlet 174 of the third layer 156in an assembled state. As best shown in FIG. 15, the inner region 184 ofthe second layer 154 may include a plurality of impingement orifices 190fluidly coupled with the recessed fluid channel 176 of the third layer156 and configured to direct jets of coolant fluid to the heat sinkfeature 162 of the first layer 152 that is in thermal communication witha power module 58. In various aspects, the heat sink feature 162 mayinclude a microchannel array, or the like, configured to receive jets ofcoolant fluid and remove heat from an adjacent heat generating device.

In the assembled state, the first layer 152, the second layer 154, andthe third layer 156 are aligned and positioned in a stacked arrangementand are configured to cooperate to provide a flow of coolant fluid froma fluid inlet 172, defined in the third layer 156, through the recessedchannel 176 and to a first region 184 of the second layer 154. Thecoolant fluid passes through the jet impingement orifices 190 directedto the heat sink feature 162 disposed in the first layer 152. Thecoolant fluid is further directed back to the recessed channel 182 ofthe second layer 154 and through an outer region 186 of the recessedchannel 182 of the second layer 154 to the fluid outlets 188, 174 in therespective second and third layers, 154, 156.

FIG. 19 is a side plan view of another exemplary vehicle motor housing54 having a modular cooling system with a plurality of coolingassemblies 200 disposed adjacent the vehicle motor housing. FIG. 20 isan exploded, isometric view of one of the exemplary cooling assembliesof FIG. 19. In various aspects, the cooling assembly 200 is providedwith a first cooling structure 202 defining at least one major exteriorheat transfer surface 204 in thermal communication with the vehiclemotor, via the housing. A second cooling structure 206 is provided,defining at least one major exterior heat transfer surface 208 inthermal communication with a power module 58. An interlayer structure210 is provided, disposed between the first cooling structure 202 andthe second cooling structure 206, and may be optionally configured tocouple the first cooling structure 202 to the second cooling structure206.

In an assembled state, the first cooling structure 202, the secondcooling structure 206, and the interlayer structure 210 are positionedin a stacked arrangement, defining a coolant flow path therein. Forexample, the cooling assembly 200 is configured to provide a flow ofcoolant fluid from a fluid inlet area 212, shown being provided by thefirst cooling structure 202, through the interlayer structure 210, andto at least one heat sink feature 214 of the second cooling structure206. The coolant fluid may further be directed through a fluid outletarea 216, shown being provided by the second cooling structure 206.

As stated with respect to other aspects of the technology, furtherdetails of the coolant fluid circuit prior to entry in the fluid inletarea 212 and after exiting the fluid outlet are 216 are not shown forsimplicity, and will depend on various other design considerations thatone of ordinary skill in the art would be able to make with theappropriate modifications.

As shown in FIG. 20, the heat sink feature 216 of the second coolingstructure 206 may include a plurality of fins, pins, or a microchannelarray, or the like, that is ultimately in thermal communication with thepower module 58 (FIG. 19). In various aspects, the bottom portion 218 ofthe second structure 206 may include an impingement surface 220 andserve as a heat sink/transfer plate.

The first cooling structure 202 is in thermal communication with ahousing 54 of the vehicle motor 52 and, as shown, defines a plurality ofchannels 222, which ultimately provide a plurality of apertures definedin a side wall 224 of the first cooling structure configured to directthe coolant fluid across the first cooling structure 202 and ultimatelytoward the interlayer structure. The shapes and sizes of the channels,apertures, and other conduits may vary based on design considerations.

The interlayer structure 210 may be provided with a plurality of jetimpingement orifices 226 configured to direct jets of coolant fluid tothe heat sink feature 214 of the second cooling structure 206. The heatsink feature 214 may be provided with a suitable geometry to work withthe bottom portion 218 of the second structure 206 to direct the coolantfluid to the fluid outlet area.

The foregoing description is provided for purposes of illustration anddescription and is in no way intended to limit the disclosure, itsapplication, or uses. It is not intended to be exhaustive or to limitthe disclosure. Individual elements or features of a particularembodiment are generally not limited to that particular embodiment, but,where applicable, are interchangeable and can be used in a selectedembodiment, even if not specifically shown or described. The same mayalso be varied in many ways. Such variations should not be regarded as adeparture from the disclosure, and all such modifications are intendedto be included within the scope of the disclosure.

As used herein, the phrase at least one of A, B, and C should beconstrued to mean a logical (A or B or C), using a non-exclusive logical“or.” It should be understood that the various steps within a method maybe executed in different order without altering the principles of thepresent disclosure. Disclosure of ranges includes disclosure of allranges and subdivided ranges within the entire range, including theendpoints.

The headings (such as “Background” and “Summary”) and sub-headings usedherein are intended only for general organization of topics within thepresent disclosure, and are not intended to limit the disclosure of thetechnology or any aspect thereof. The recitation of multiple embodimentshaving stated features is not intended to exclude other embodimentshaving additional features, or other embodiments incorporating differentcombinations of the stated features.

As used herein, the terms “comprise” and “include” and their variantsare intended to be non-limiting, such that recitation of items insuccession or a list is not to the exclusion of other like items thatmay also be useful in the devices and methods of this technology.Similarly, the terms “can” and “may” and their variants are intended tobe non-limiting, such that recitation that an embodiment can or maycomprise certain elements or features does not exclude other embodimentsof the present technology that do not contain those elements orfeatures.

As used herein, the term “vehicle” should be construed having a broadmeaning, and should include all types of vehicles, with non-limitingexamples including a passenger car, truck, motorcycle, off-road vehicle,bus, boat, airplane, helicopter, lawn mower, recreational vehicle,amusement park vehicle, farm vehicle, construction vehicle, tram, golfcart, train, or trolley, etc.

For purposes of this disclosure, the term “coupled” (and its variants)generally means the joining of two components directly or indirectly toone another. For example, the joining can be stationary in nature ormovable in nature. The joining may be achieved with the two components,and any additional intermediate members or components being integrallyformed as a single unitary body with one another or with the twocomponents. Such joining may be permanent in nature or may be movable orreleasable in nature, unless otherwise stated.

The broad teachings of the present disclosure can be implemented in avariety of forms. Therefore, while this disclosure includes particularexamples, the true scope of the disclosure should not be so limitedsince other modifications will become apparent to the skilledpractitioner upon a study of the specification and the following claims.Reference herein to one aspect, or various aspects means that aparticular feature, structure, or characteristic described in connectionwith an embodiment or particular system is included in at least oneembodiment or aspect. The appearances of the phrase “in one aspect” (orvariations thereof) are not necessarily referring to the same aspect orembodiment. It should be also understood that the various method stepsdiscussed herein do not have to be carried out in the same order asdepicted, and not each method step is required in each aspect orembodiment.

What is claimed is:
 1. A cooling system for simultaneously cooling botha power module and a vehicle motor, the cooling system comprising: avehicle motor housing; a plurality of manifolds in thermal communicationwith the vehicle motor housing, each manifold defining: a cooling fluidinlet; a cooling fluid outlet; and a distribution recess providing fluidcommunication between the cooling fluid inlet and the cooling fluidoutlet, the distribution recess at least partially defined by a wallhaving an exterior major surface in thermal communication with thevehicle motor; a manifold fluid insert disposed within the distributionrecess, the manifold fluid insert defining a plurality of inlet branchchannels and a plurality of outlet branch channels; a power modulethermally coupled to the manifold; and a first heat sink featuredisposed between the power module and the manifold fluid insert, whereina flow of coolant fluid is provided from each cooling fluid inlet,through the inlet branch channels of the manifold fluid insert forimpingement with the first heat sink feature, wherein the coolant fluidis then returned through the outlet branch channels of the manifoldfluid insert and to the cooling fluid outlet of the respective manifold.2. The cooling system according to claim 1, wherein the first heat sinkfeature is integrated with the power module and comprises a plurality offins or pins.
 3. The cooling system according to claim 1, furthercomprising a second heat sink feature disposed in the distributionrecess and in thermal communication with the vehicle motor.
 4. Thecooling system according to claim 3, wherein the second heat sinkfeature comprises a heat sink plate with a plurality of fins or pins. 5.The cooling system according to claim 3, wherein the wall defining thedistribution recess has an interior major surface, opposite the exteriormajor surface, and the heat sink feature is integrated with the interiormajor surface.
 6. The cooling system according to claim 1, wherein theplurality of manifolds are integrally formed as part of the vehiclemotor housing.
 7. The cooling system according to claim 1, wherein theplurality of manifolds are modular units coupled to the vehicle motorhousing.
 8. A modular cooling system for simultaneously cooling both apower module and a vehicle motor, the modular cooling system including aplurality of layered assemblies, each layered assembly comprising: afirst layer defining upper and lower opposing major surfaces, the uppermajor surface of the first layer comprising a heat sink feature inthermal communication with one of the power module and the vehiclemotor; a second layer defining upper and lower opposing major surfaces,the upper major surface of the second layer being located adjacent tothe lower major surface of the first layer; and a third layer definingupper and lower opposing major surfaces, the upper major surface of thethird layer being located adjacent to the lower major surface of thesecond layer, and the lower major surface of the third layer being inthermal communication with the other of the power module and the vehiclemotor, wherein the first layer, the second layer, and the third layerare positioned in a stacked arrangement and configured to provide a flowof coolant fluid from a fluid inlet, defined in the third layer, throughan inner region of the second layer, and to the heat sink featurelocated in the first layer, wherein the coolant fluid is furtherdirected back through an outer region of the second layer and to a fluidoutlet defined in the third layer.
 9. The modular cooling systemaccording to claim 8, wherein the upper major surface of the third layerdefines a recessed fluid channel therein, providing fluid communicationbetween the fluid inlet and the inner region of the second layer. 10.The modular cooling system according to claim 9, wherein the recessedfluid channel provides thermal communication between the flow of coolantfluid and the power module or the vehicle motor.
 11. The modular coolingsystem according to claim 8, wherein the upper major surface of thesecond layer defines a recessed fluid channel therein, providing fluidcommunication between the inner region and outer region of the secondlayer.
 12. The modular cooling system according to claim 11, wherein theinner region of the second layer comprises a plurality of impingementorifices fluidly coupled to the recessed fluid channel of the thirdlayer and configured to direct jets of coolant fluid to the heat sinkfeature of the first layer.
 13. The modular cooling system according toclaim 12, wherein the heat sink feature comprises a microchannel array.14. The modular cooling system according to claim 8, wherein the uppermajor surface of the first layer is in thermal communication with thepower module and the lower major surface of the third layer is inthermal communication with the vehicle motor.
 15. The modular coolingsystem according to claim 8, wherein the third layer defines each of thefluid inlet and the fluid outlet as one or more apertures extendingbetween the upper and lower major surfaces of the third layer.
 16. Amodular cooling system for simultaneously cooling both a power moduleand a vehicle motor, the modular cooling system including a plurality ofcooling assemblies, each cooling assembly comprising: a first coolingstructure defining at least one major surface in thermal communicationwith the vehicle motor; a second cooling structure defining at least onemajor surface in thermal communication with a power module; and aninterlayer structure configured to couple the first cooling structure tothe second cooling structure, wherein the first cooling structure, thesecond cooling structure, and the interlayer structure are positioned ina stacked arrangement and configured to provide a flow of coolant fluidfrom a fluid inlet defined in first cooling structure, through theinterlayer structure, and to at least one heat sink feature of thesecond cooling structure, wherein the coolant fluid is further directedthrough a fluid outlet defined in the second cooling structure.
 17. Themodular cooling system according to claim 16, wherein the heat sinkfeature of the second cooling structure comprises a plurality of fins orpins in thermal communication with the power module.
 18. The modularcooling system according to claim 16, wherein the first coolingstructure is in thermal communication with a housing of the vehiclemotor and defines a plurality of channels configured to direct thecoolant fluid across the first cooling structure and toward theinterlayer structure.
 19. The modular cooling system according to claim16, wherein the fluid inlet comprises a plurality of apertures definedin a side wall of the first cooling structure.
 20. The modular coolingsystem according to claim 16, wherein the interlayer structure comprisesa plurality of impingement orifices configured to direct jets of coolantfluid to the heat sink feature of the second cooling structure.